Seoul moves to classify HBM and advanced chip packaging as national core technologies, tightening foreign access
Kai Tanaka ·
South Korea’s industry ministry on Wednesday proposed adding high bandwidth memory stacking and advanced chip packaging to the country’s National Core Technologies list, a shift that would trigger tighter export licensing and foreign investment reviews. The draft, posted Tuesday in Seoul, targets process know-how that underpins Nvidia and AMD accelerators and the global memory supply chain anchored by SK Hynix and Samsung Electronics.
The move matters because it formalizes national security protections around HBM and packaging at the same time demand for AI hardware is still outpacing supply. It also aligns Seoul more closely with partner countries that have already tightened chip technology controls, and it raises compliance thresholds for any cross-border deals or technology transfers involving Korean firms.
What the draft covers The notice singles out through silicon via formation, hybrid bonding for next generation HBM, and 2.5D or 3D integration that links logic and memory on interposers or stacked packages. It also flags advanced organic substrates used in high pin count server and AI accelerators. If finalized, these items would fall under the Act on Prevention of Divulgence and Protection of Industrial Technology and the Foreign Investment Promotion Act, which allow authorities to require prior approval for technology exports, joint ventures, and M&A.
A public comment period will precede a final designation later this year, according to the ministry’s posting. Reviews would be handled by the Industrial Technology Protection Committee, which includes representatives from the Ministry of Trade, Industry and Energy and national security agencies.
Why it matters for AI supply chains SK Hynix held the largest share of HBM shipments in 2024, with Samsung ramping HBM3E and courting qualification for Nvidia platforms. Both companies are moving to hybrid bonding in HBM4, which increases sensitivity around process recipes, materials, and defect control. Any added licensing steps could affect collaborations with overseas foundries and outsourced assembly providers, including work tied to TSMC’s CoWoS or alternatives from Samsung Foundry and Amkor.
Stricter controls would also complicate China-facing arrangements. US rules already limit AI accelerator shipments to China, and Beijing has been seeking access to HBM and packaging capacity through third countries. Korean oversight on technology transfers, engineering services, and equipment shipments for stacking and packaging would narrow those paths.
For global chipmakers, cloud providers, and equipment vendors, the draft signals more fragmentation in the governance of AI hardware. Expect longer lead times on cross-border R&D and manufacturing agreements, a premium on domestic packaging capacity, and added scrutiny of talent moves and supplier audits across Asia.